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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems

Hardback (30 Dec 2021)

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Publisher's Synopsis

Book information

ISBN: 9781032160818
Publisher: CRC Press
Imprint: CRC Press
Pub date:
DEWEY: 621.381046
DEWEY edition: 23
Language: English
Number of pages: 342
Weight: 592g
Height: 224mm
Width: 243mm
Spine width: 24mm