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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems

1st edition

Paperback (26 Aug 2024)

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Publisher's Synopsis

Book information

ISBN: 9781032160856
Publisher: CRC Press
Imprint: CRC Press
Pub date:
Edition: 1st edition
DEWEY: 621.381046
DEWEY edition: 22
Language: English
Number of pages: 290
Weight: 470g
Height: 233mm
Width: 157mm
Spine width: 21mm