Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging Series

John W. Balde

2003

Hardback (31 Jan 2003)

$196.22

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New: Paperback (23 Feb 2014) - Softcover reprint of the original 1st Edition 2003 $189.89

Publisher's Synopsis

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Book information

ISBN:	9780792376767
Publisher:	Springer US
Imprint:	Springer
Pub date:	31 Jan 2003
Edition:	2003
DEWEY:	621.381046
DEWEY edition:	21
Language:	English
Number of pages:	338
Weight:	1550g
Height:	234mm
Width:	156mm
Spine width:	22mm