Softcover reprint of the original 1st Edition 2003
Paperback (23 Feb 2014)
Includes delivery to the United States
10+ copies available online - Usually dispatched within 7 days
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
| ISBN: | 9781461349778 |
| Publisher: | Springer US |
| Imprint: | Springer |
| Pub date: | 23 Feb 2014 |
| Edition: | Softcover reprint of the original 1st Edition 2003 |
| Language: | English |
| Number of pages: | 347 |
| Weight: | 569g |
| Height: | 235mm |
| Width: | 155mm |
| Spine width: | 20mm |
$5.18off
The Clock in the Sun
Hardback
Published 08 Oct 2024
Save $5.18
$3.99off
Honey Bee Social Evolution
Hardback
Published 14 Jan 2025
Save $3.99
$4.10off
Abstract Algebra With Applicati...
Hardback
Published 11 Nov 2024
Save $4.10
$0.40off
Charging Forward
Hardback
Published 05 Dec 2024
Save $0.40
$0.65off
Fluid Mechanics
Paperback
Published 17 Oct 2024
Save $0.65
Pedrottis' Introduction to Optics
Hardback
Published 31 Oct 2024
$0.81off
Fire Ecology of Florida and the...
Paperback
Published 30 Nov 2024
Save $0.81
$0.02off
Interstellar
Paperback
Published 29 Aug 2024
Save $0.02
$10.89off
Reclaiming Our Planet
Hardback
Published 06 Aug 2024
Save $10.89