Hardback (01 Jul 1998)
Not available for sale
Out of stock
Taken from the 2nd edition of the classic 3-volume Microelectronics Packaging Handbook, this title contains specific, fundamental coverage of microelectronics wirebonding.
| ISBN: | 9780412154812 |
| Publisher: | Chapman & Hall |
| Imprint: | Chapman & Hall |
| Pub date: | 01 Jul 1998 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 21 |
| Number of pages: | 159 |
| Weight: | -1g |
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