Delivery included to the United States

Wafer Scale Integration

Wafer Scale Integration Proceedings of the IFIP WG 10.5 Workshop on Wafer Scale Integration, Grenoble, France, 17-19 March, 1986

Book (31 Oct 1986)

Not available for sale

Out of stock

This service is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Publisher's Synopsis

Wafer Scale Integration (WSI) is approached from three angles in this book: proposed architectures, CAD tools, and the technology techniques required for their implementation. Some of the recent proposals for WSI architectures examined in this volume include: reconfigurable building blocks; reconfigurable microprocessors; systolic arrays for image processing; and parallel computing machines. The criteria of cost, performance and reliability are applied to these proposals in an attempt to select the best candidate for WSI. Fascinating technological advances for WSI, such as copper tracking and laser panthography, are also described. The second section examines basic software techniques useful for WSI (test, reconfiguration. general CAD). And the final section stresses the need to move away from "abstract" architectural discussions and base further effort in the real world.

Book information

ISBN: 9780444701039
Publisher: North-Holland
Imprint: North-Holland
Pub date:
DEWEY: 621.38173
DEWEY edition: 19
Language: English
Number of pages: 353
Weight: -1g
Height: 230mm
Width: 150mm