Book (31 Mar 2003)
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This text covers topics including: leading edge packaging technology; Pb-free interconnections; quality and reliability issues of portable products; high-density substrates and embedded components; and leaded and lead-free solder characterization and modelling.
| ISBN: | 9780780379916 |
| Publisher: | Institute of Electrical and Electronics Engineers] |
| Imprint: | Institute of Electrical and Electronics Engineers] |
| Pub date: | 31 Mar 2003 |
| DEWEY: | 621.381 |
| DEWEY edition: | 22 |
| Language: | English |
| Weight: | -1g |
| Height: | 279mm |
| Width: | 216mm |
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