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Tin and Solder Plating in the Semiconductor Industry

Tin and Solder Plating in the Semiconductor Industry A Technical Guide

1993

Hardback (30 Nov 1992)

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Publisher's Synopsis

The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.

Book information

ISBN: 9780412482403
Publisher: Springer Netherlands
Imprint: Springer
Pub date:
Edition: 1993
DEWEY: 621.38152
DEWEY edition: 20
Language: English
Number of pages: 326
Weight: 1480g
Height: 234mm
Width: 156mm
Spine width: 20mm