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Thin Films: Stresses and Mechanical Properties IX: Volume 695

Thin Films: Stresses and Mechanical Properties IX: Volume 695 - MRS Proceedings

Hardback (01 Apr 2002)

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Publisher's Synopsis

This book, the ninth in a popular series from the Materials Research Society, is strengthened by invited and contributed papers covering a wide range of subjects, from processing-microstructure-mechanical property relationships, strain effects and self-organization in thin films, nanoscale defects and thermomechanical behavior of materials, to novel nanscale materials testing. While the collection continues the series theme of materials science related modeling and characterization of mechanical properties of materials, special focus is given to: strain relaxation and strengthening mechanisms; defects formation; mechanical properties and nanoscale testing; adhesion and fracture; thin-film applications in MEMS; computational modeling and experiments; and film deposition, microstructure, evolution and intrinsic stress.

About the Publisher

Cambridge University Press

Cambridge University Press dates from 1534 and is part of the University of Cambridge. We further the University's mission by disseminating knowledge in the pursuit of education, learning and research at the highest international levels of excellence.

Book information

ISBN: 9781558996311
Publisher: Materials Research Society
Imprint: Cambridge University Press
Pub date:
Language: English
Number of pages: 534
Weight: 1000g
Height: 234mm
Width: 160mm
Spine width: 33mm