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Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 7

Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 7 Proceedings of the 2020 Annual Conference on Experimental and Applied Mechanics - Conference Proceedings of the Society for Experimental Mechanics Series

Paperback (06 Mar 2022)

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Publisher's Synopsis

Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 7 of the Proceedings of the 2020 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of sseven from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:

Test Design and Inverse Method Algorithms

Inverse Problems: Virtual Fields Method

Residual Stresses: Measurement, Uncertainty & Validation

Residual Stresses: Eigenvalues, Modeling, & Crack Growth

Material Characterizations Using Thermography

Fatigue, Damage & Fracture Evaluation Using Infrared Thermography

Book information

ISBN: 9783030598662
Publisher: Springer International Publishing
Imprint: Springer
Pub date:
DEWEY: 531
DEWEY edition: 23
Language: English
Number of pages: 104
Weight: 308g
Height: 279mm
Width: 210mm
Spine width: 6mm