Publisher's Synopsis
The volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognised as an important factor in current design methodology. The topics covered include thermal management in general, analytical and computational thermal modelling, thermal characterisation of components, single and multiphase convective cooling, measurement techniques, thermomechanical modelling and thermally induced failure. Audience: Research and development engineers and scientists whose work involves the design and manufacture of electronic systems.
