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Thermal Conductivity29/Thermal Expansion 17

Thermal Conductivity29/Thermal Expansion 17

Hardback (30 Dec 2008)

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Publisher's Synopsis

Among the subjects investigated include: Thermal Expansion on the JWST; New TC Measurement Technologies; Emissivity; Low-K Bulk Materials; Building Insulation; Plastics and Particles; Porosity; Metals; Thin Films; and Nuclear.

Book information

ISBN: 9781932078725
Publisher: DEStech Publications, Inc.
Imprint: DEStech Publications
Pub date:
Language: English
Weight: 1088g
Height: 234mm
Width: 158mm
Spine width: 31mm