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Thermal Conductivity, Thermal Expansion

Thermal Conductivity, Thermal Expansion Proceedings of the 28th International Thermal Conductivity Conference and the 16th International Thermal Expansion Symposium June 26-29, 2005, New Brunswick, Canada

Hardback (28 Dec 2006)

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Publisher's Synopsis

This book presents the most current research on heat flow in materials, ranging from metals to newer materials such as thin films and nanowires.

Book information

ISBN: 9781932078596
Publisher: DEStech Publications, Inc.
Imprint: DEStech Publications
Pub date:
Language: English
Number of pages: 556
Weight: 907g
Height: 234mm
Width: 158mm
Spine width: 31mm