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Thermal Conductivity 26

Thermal Conductivity 26 Thermal Expansion 14 : Joint Conferences, August 6-8, 2001, Cambridge, Massachusetts, USA

Hardback (01 Jan 2001)

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Publisher's Synopsis

Major edited presentations of new developments in materials science and technology.

Book information

ISBN: 9781932078367
Publisher: DEStech Publications, Inc.
Imprint: DEStech Publications
Pub date:
DEWEY: 620.11296
DEWEY edition: 21
Language: English
Number of pages: 581
Weight: 929g
Height: 241mm
Width: 158mm
Spine width: 31mm