Publisher's Synopsis
These proceedings, a result of the U.S. army's commitment to improving the quality and reliability of adhesively bonded structures in present and future systems, will serve as a reference in the field of adhesion. The contributors emphasize, in the short term, root cause analysis of bond failures and the development of remedies for bond failure in equipment, in production and in the field. In the long term, the emphasis is on ensuring that adequate technology is available for the adhesive bonding of emerging materials, such as thermoplastic matrix composites, that will be appearing in future-generation equipment, and on the development of detailed models of bonded structures in order to describe the entire life cycle of a bond from its initial design to in-service deterioration. This work is an information source for all researchers involved with new materials and adhesive bonding.
