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The International Conference on Electronics, Engineering Physics and Earth Science (EEPES 2024)

The International Conference on Electronics, Engineering Physics and Earth Science (EEPES 2024)

Hardback (05 Nov 2024)

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Publisher's Synopsis

Book information

ISBN: 9783725824137
Publisher: Mdpi AG
Imprint: Mdpi AG
Pub date:
Language: English
Number of pages: 592
Weight: -1g
Height: 244mm
Width: 170mm
Spine width: 43mm