Publisher's Synopsis
The book titled ""The Effects Of Organic And Inorganic Addition-Agents Upon The Electrodeposition Of Copper From Electrolytes Containing Arsenic"" by Wen, Ching Yu is a scientific study that explores the effects of organic and inorganic addition-agents on the electrodeposition of copper from electrolytes that contain arsenic.The book provides a comprehensive analysis of the electrochemical behavior of copper in the presence of arsenic and the role of various organic and inorganic additives in the electrodeposition process. The author has conducted a series of experiments and studies to investigate the impact of different additives on the quality and efficiency of copper electrodeposition.The book is divided into several chapters, each of which focuses on a specific aspect of the study. The first chapter provides an overview of the electrochemical behavior of copper and the influence of arsenic on the electrodeposition process. The subsequent chapters delve deeper into the role of various organic and inorganic additives, such as surfactants, complexing agents, and reducing agents, in enhancing the quality and efficiency of copper electrodeposition.The book is a valuable resource for researchers, scientists, and engineers who are interested in the field of electrochemistry and electroplating. It provides a detailed analysis of the factors that affect the electrodeposition of copper and offers insights into the development of new and improved electroplating processes.This scarce antiquarian book is a facsimile reprint of the old original and may contain some imperfections such as library marks and notations. Because we believe this work is culturally important, we have made it available as part of our commitment for protecting, preserving, and promoting the world's literature in affordable, high quality, modern editions, that are true to their original work.
