Book (01 Jan 1993)
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Out of stock
Compiles translations of articles previously available only in the Japanese-language journal Surface Mount Technology . Coverage is grouped into six parts: trends in surface mount technology (SMT), SMT equipment, developments in solder technology, tape automated bending, chips on board technology, and multichip modules and printed circuit board tec
| ISBN: | 9780780304079 |
| Publisher: | Institute of Electrical and Electronics Engineers |
| Imprint: | Institute of Electrical and Electronics Engineers |
| Pub date: | 01 Jan 1993 |
| Language: | English |
| Number of pages: | 315 |
| Weight: | 635g |
| Height: | 241mm |
| Width: | 165mm |
| Spine width: | 25mm |
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