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Stress-Induced Phenomena in Metallization

Stress-Induced Phenomena in Metallization Ninth International Workshop on Stress-Induced Phenomena in Metallization, Kyoto, Japan 4 - 6 April 2007 - AIP Conference Proceedings

2007

Hardback (13 Nov 2007)

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Publisher's Synopsis

The conference was on reliability related science in ULSI interconnect. Its main purpose was to discuss the stress induced phenomena in the LSI interconnect among academic researchers and industry engineers to establish academic science and to improve the reliability of ULSI chips. All papers were peer reviewed.

Book information

ISBN: 9780735404595
Publisher: American Institute of Physics
Imprint: American Institute of Physics
Pub date:
Edition: 2007
Language: English
Number of pages: 204
Weight: 458g
Height: 234mm
Width: 162mm
Spine width: 16mm