2004
Hardback (01 Dec 2004)
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Out of stock
These proceedings contain new research results and advances in basic understanding of stress-induced phenomena in metallization. Papers cover results on electromigration, thermal stresses and void formation in copper-low k interconnect structures.
| ISBN: | 9780735402256 |
| Publisher: | American Institute of Physics |
| Imprint: | American Institute of Physics |
| Pub date: | 01 Dec 2004 |
| Edition: | 2004 |
| DEWEY: | 621.38152 |
| DEWEY edition: | 22 |
| Language: | English |
| Number of pages: | 272 |
| Weight: | 1280g |
| Height: | 235mm |
| Width: | 155mm |
| Spine width: | 17mm |
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