2006
Hardback (01 Feb 2006)
Not available for sale
Out of stock
These proceedings present current research on issues related to stress-induced phenomena in on-chip metal interconnects and solder joints. The volume will appeal to scientists, engineers, graduate students interested in research and development of microelectronic devices as well as technology integration, and semiconductor industry professionals and equipment suppliers.
| ISBN: | 9780735403109 |
| Publisher: | American Institute of Physics |
| Imprint: | American Institute of Physics |
| Pub date: | 01 Feb 2006 |
| Edition: | 2006 |
| DEWEY: | 621.38152 |
| DEWEY edition: | 22 |
| Language: | English |
| Number of pages: | 372 |
| Weight: | 742g |
| Height: | 235mm |
| Width: | 155mm |
| Spine width: | 25mm |
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