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Stress Induced Phenomena and Reliability in 3D Microelectronics

Stress Induced Phenomena and Reliability in 3D Microelectronics Kyoto, Japan, 28-30 May 2012 - AIP Proceedings

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Book information

ISBN: 9780735412354
Publisher: AIP Publishing
Imprint: AIP Publishing
Pub date:
Number of pages: vi, 185