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Spice Based Heat Transport Model for Non-Intrusive Thermal Diagnostic Applications

Spice Based Heat Transport Model for Non-Intrusive Thermal Diagnostic Applications

Paperback (17 Aug 2005)

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Publisher's Synopsis

This research text provides a detailed look at the equivalence between the thermal system of equations and the variables of circuit theory. This relationship is used together with SPICE (Simulation Program with Integrated Circuits Emphasis), to accurately model heat flow with traditional methods in electrical engineering. The book details the computational complexity of heat flow and why an electrical analogue to the thermal system improves the efficiency and computational speed of the solutions.

Book information

ISBN: 9781419606137
Publisher: Booksurge Publishing
Imprint: Booksurge Publishing
Pub date:
Language: English
Number of pages: 160
Weight: 290g
Height: 178mm
Width: 254mm
Spine width: 9mm