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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies - Electronic Packaging and Interconnection Series

Hardback (01 Dec 1996)

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    Publisher's Synopsis

    As electronic components and their sub-assemblies diminish in size, soldered joint reliability problems increase. The authors of this book, both experts in the field, offer theoretical and practical advice on how to achieve consistent quality soldering.

    Book information

    ISBN: 9780070366480
    Publisher: McGraw-Hill Education
    Imprint: McGraw-Hill
    Pub date:
    DEWEY: 621.381046
    DEWEY edition: 21
    Number of pages: 408
    Weight: 700g
    Height: 230mm
    Width: 155mm
    Spine width: 35mm

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