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Solder Joint Reliability Prediction for Multiple Environments

Solder Joint Reliability Prediction for Multiple Environments

Softcover reprint of hardcover 1st Edition 2009

Paperback (05 Nov 2010)

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Publisher's Synopsis

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Book information

ISBN: 9781441946348
Publisher: Springer US
Imprint: Springer
Pub date:
Edition: Softcover reprint of hardcover 1st Edition 2009
Language: English
Number of pages: 192
Weight: 326g
Height: 234mm
Width: 156mm
Spine width: 11mm