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Semiconductor Wafer Bonding VIII: Science, Technology, and Applications, 2005

Semiconductor Wafer Bonding VIII: Science, Technology, and Applications, 2005 Proceedings Of The International Symposium

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Book information

ISBN: 9781566774604
Publisher: Electrochemical Society
Imprint: Electrochemical Society
Language: English
Number of pages: 462 p.
Weight: -1g
Height: 228mm
Width: 152mm
Spine width: 25mm