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Semiconductor Device Modeling With SPICE

Semiconductor Device Modeling With SPICE

2nd Edition

Hardback (31 Jul 1993)

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Publisher's Synopsis

Book information

ISBN: 9780070024694
Publisher: McGraw-Hill Education
Imprint: McGraw-Hill
Pub date:
Edition: 2nd Edition
DEWEY: 621.38152028553
DEWEY edition: 20
Language: English
Number of pages: 479
Weight: 820g
Height: 229mm
Width: 157mm
Spine width: 34mm