Delivery included to the United States

Roadmaps of Packaging Technology

Roadmaps of Packaging Technology

Book (01 Jan 1997)

Not available for sale

Out of stock

This service is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Book information

ISBN: 9781877750618
Publisher: Integrated Circuit Engineering
Imprint: Integrated Circuit Engineering
Pub date:
DEWEY: 621.381046
DEWEY edition: 21
Language: English