Softcover reprint of the original 1st Edition 1997
Paperback (20 Jun 2013)
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Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.
| ISBN: | 9781489918062 |
| Publisher: | Springer US |
| Imprint: | Springer |
| Pub date: | 20 Jun 2013 |
| Edition: | Softcover reprint of the original 1st Edition 1997 |
| Language: | English |
| Number of pages: | 358 |
| Weight: | 587g |
| Height: | 235mm |
| Width: | 155mm |
| Spine width: | 20mm |
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