Publisher's Synopsis
Polyimide (PI) is a polymer with an imide ring structure in the backbone. As an important high-performance polymer, PI has been widely used in the aerospace and microelectronics industries due to its excellent thermal stability, mechanical properties, dimensional stability, chemical resistance, and insulation properties. Some typical applications of PI include high-temperature resistant coatings for spacecraft, structural support materials for light spacecraft, solar cell substrates, flexible printed circuit boards, and insulation layers for large integrated circuits. This book provides research on the properties and applications of PI-based materials. Chapter 1 discusses that the development of PI aerogel materials in the past decades has generated great interest in new transformation, selective functionalization and environmentally sustainable development. The research and application progress of PI aerogel materials in thermal insulation, low dielectric, hydrophobic, environmental remediation and other aspects were reviewed. Chapter 2 summarizes the latest progress in the field of PI-based thermal conductive materials, summarizes the general rules of the formation of thermal channels in composites, and introduces the latest progress of PI-based thermal conductive films obtained after graphitization, hoping to provide some guidance for the future research of thermal conductive PI materials. In the third chapter, the application of PI adhesive in the bonding of metal, battery and hybrid materials is introduced, and the influence of molecular structure on the bonding performance is analyzed. This chapter evaluates the effect of structure on properties and explains the macroscopic properties of these adhesives according to their microstructure.
