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Proceedings of the Third International Symposium on Semiconductor Wafer Bonding

Proceedings of the Third International Symposium on Semiconductor Wafer Bonding Physics and Applications - Proceedings / Electrochemical Society

Paperback (01 Jan 1995)

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Book information

ISBN: 9781566771016
Publisher: Electrochemical Society
Imprint: Electrochemical Society
Pub date:
DEWEY: 621.38152
DEWEY edition: 20
Language: English
Number of pages: 610
Weight: 997g
Height: 234mm
Width: 165mm
Spine width: 38mm