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Proceedings of the IEEE 2003 International Interconnect Technology Conference

Proceedings of the IEEE 2003 International Interconnect Technology Conference Hyatt Regency Hotel, Burlingame, CA, June 2-4, 2003

Book (30 Jun 2003)

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    Publisher's Synopsis

    Topics discussed in this volume include: metallization; dielectrics; silicide and salicide; CMP/Planarization; dry processing; process integration; internconnect systems; process control/modelling; and reliability.

    Book information

    ISBN: 9780780377974
    Publisher: IEEE
    Imprint: IEEE
    Pub date:
    DEWEY: 621.38152
    DEWEY edition: 22
    Language: English
    Number of pages: 272
    Weight: -1g

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