Hardback (31 Oct 1998)
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This volume is based on a conference designed to provide a forum for profesionals in semiconductor processing, academia and equipment development to present new science and technology. Topics include: interconnect technology trends; interconnect reliability; and more.
| ISBN: | 9780780342859 |
| Publisher: | IEEE |
| Imprint: | IEEE |
| Pub date: | 31 Oct 1998 |
| DEWEY: | 621.384134 |
| DEWEY edition: | 21 |
| Language: | English |
| Number of pages: | 303 |
| Weight: | -1g |
| Height: | 266mm |
| Width: | 203mm |
| Spine width: | 19mm |
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