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Proceedings of the First International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

Proceedings of the First International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications - Proceedings / Electrochemical Society

Book (01 Jan 1992)

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Book information

ISBN: 9781566770088
Publisher: Electrochemical Society
Imprint: Electrochemical Society
Pub date:
DEWEY: 621.38152
DEWEY edition: 20
Language: English
Number of pages: 498
Weight: 703g
Height: 234mm
Width: 158mm
Spine width: 25mm