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Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems EURoSimE 2006, Grand Hotel Di Como, Como, Italy, April 24-25-26, 2006

Hardback (01 Jan 2006)

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Book information

ISBN: 9781424402755
Publisher: IEEE
Imprint: IEEE
Pub date:
Language: English
Number of pages: 774
Weight: -1g