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Proceedings of the 5th Internatioanl Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Mic

Proceedings of the 5th Internatioanl Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Mic

Paperback (02 Oct 2004)

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Book information

ISBN: 9780780384200
Publisher: IEEE Service Ctr
Pub date:
Number of pages: 627 p.