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Proceedings of the 4th International Symposium on Electronic Materials and Packaging

Proceedings of the 4th International Symposium on Electronic Materials and Packaging December 4-6, 2002, Kaosiung, Taiwan

Hardback (01 Jan 2002)

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Book information

ISBN: 9780780376823
Publisher: IEEE
Imprint: IEEE
Pub date:
DEWEY: 621.381046
DEWEY edition: 22
Language: English
Number of pages: 498