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Proceedings of the 3rd International Symposium on Electronic Materials and Packaging 2001

Proceedings of the 3rd International Symposium on Electronic Materials and Packaging 2001 November 19-22, 2001, Jeju Island, Korea

Paperback (31 Dec 2001)

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    Book information

    ISBN: 9780780371576
    Publisher: IEEE
    Imprint: IEEE
    Pub date:
    DEWEY: 621.381046
    DEWEY edition: 22
    Language: English
    Number of pages: 449
    Weight: -1g
    Height: 230mm

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