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Proceedings of the 1999 7th International Symposium on the Physical & Failure Analysis of Integrated Circuits [IPFA '99

Proceedings of the 1999 7th International Symposium on the Physical & Failure Analysis of Integrated Circuits [IPFA '99 5-9 July, 1999, Orchard Hotel, Singapore]

Hardback (30 Sep 1999)

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Publisher's Synopsis

Aimed at integrated circuit designers, solid state component designers and packaging and manufacturing engineers, these proceedings cover such subjects as: failure analysis technologies; process and device; packaging and metallization; dielectrics; and reliability of specialist devices.

Book information

ISBN: 9780780351875
Publisher: IEEE
Imprint: IEEE
Pub date:
DEWEY: 621.3815
DEWEY edition: 22
Language: English
Number of pages: 209
Weight: -1g
Height: 292mm
Width: 209mm
Spine width: 12mm