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Proceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits [IPFA '97

Proceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits [IPFA '97 21-25 July, 1997, Raffles City Convention Centre, Singapore]

Hardback (31 Oct 1997)

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    Publisher's Synopsis

    Failure analysis and reliability improvement are linked for improvement of microcircuits packaging by these technical papers. Design factors such as oxide reliability, electromigration and die metallization are considered in testing, and analytic approaches to improved reliability.

    Book information

    ISBN: 9780780339859
    Publisher: Institute of Electrical and Electronics Engineers
    Imprint: Institute of Electrical and Electronics Engineers
    Pub date:
    DEWEY: 621.3815
    DEWEY edition: 21
    Language: English
    Weight: -1g
    Height: 304mm
    Width: 215mm
    Spine width: 19mm

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