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Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 Presented at Adhesives'98 : Binghamton, New York, September 28-30, 1998

Hardback (31 Jul 1998)

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    Publisher's Synopsis

    This volume is the result of the 3rd International Conference on Adhesives Joining and Coating Technologies in Electronic Manufacturing. It addresses issues such as flip-chips with ACA; adhesion; viscoelastic properties; package technologies; and reliability.

    Book information

    ISBN: 9780780349346
    Publisher: IEEE
    Imprint: IEEE
    Pub date:
    DEWEY: 621.381046
    DEWEY edition: 21
    Language: English
    Number of pages: 365
    Weight: -1g

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