Hardback (28 Feb 2001)
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Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
| ISBN: | 9780780366442 |
| Publisher: | IEEE |
| Imprint: | IEEE |
| Pub date: | 28 Feb 2001 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 22 |
| Language: | English |
| Number of pages: | 467 |
| Weight: | -1g |
| Height: | 292mm |
| Width: | 209mm |
| Spine width: | 25mm |
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