Hardback (31 Aug 1998)
Not available for sale
Out of stock
This volume covers topics including: multichip modules; micro/chip scale packaging; advanced PWBs; portables and IC packaging; MCM thermal management; modern wirebonding technology; polymers for electronic packaging; and materials, processes and reliability.
| ISBN: | 9780780348509 |
| Publisher: | Institute of Electrical and Electronics Engineers |
| Imprint: | Institute of Electrical and Electronics Engineers |
| Pub date: | 31 Aug 1998 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 21 |
| Language: | English |
| Number of pages: | 547 |
| Weight: | -1g |
The Ninth Metal
Paperback
Published 13 Jan 2022
$0.61off
Materials
Paperback
Published 15 Dec 2018
Save $0.61
Harmonograph
Paperback
Published 25 Oct 2005
Creative Stitched Shibori
Paperback
Published 15 May 2024
$3.77off
Sustainable Advanced Manufactur...
Paperback
Published 07 Oct 2024
Save $3.77
$4.39off
Metal-Crucible Interactions
Paperback
Published 08 Oct 2024
Save $4.39
Industrial Internet of Things S...
Hardback
Published 28 Oct 2024
Powering the Lean Enterprise
Hardback
Published 01 Nov 2024
Copper Overview
Hardback
Published 28 Aug 2024