Book (30 Apr 1998)
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Focusing on IC / package design integration, this volume examines logic and memory, interconnection, high-level design methodologies, flip-chip, RF-wireless, package design, and modelling and analysis.
| ISBN: | 9780818684333 |
| Publisher: | IEEE Computer Society Press |
| Imprint: | IEEE Computer Society Press |
| Pub date: | 30 Apr 1998 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 21 |
| Language: | English |
| Number of pages: | 149 |
| Weight: | -1g |
| Height: | 279mm |
| Width: | 216mm |
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