Hardback (31 Dec 1997)
Not available for sale
Out of stock
Designed for manufacturing engineers and product designers, this conference provides the latest developments in the field of polymeric electronic packaging.
| ISBN: | 9780780338654 |
| Publisher: | IEEE Service Center |
| Imprint: | IEEE Service Center |
| Pub date: | 31 Dec 1997 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 22 |
| Language: | English |
| Number of pages: | 333 |
| Weight: | -1g |
| Height: | 304mm |
| Width: | 215mm |
| Spine width: | 19mm |
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