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Proceeding of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)

Proceeding of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) June 30-July 3, 2004, Bao Long Hotel, Shanghai, China

Hardback (01 Jan 2004)

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Book information

ISBN: 9780780386204
Publisher: IEEE
Imprint: IEEE
Pub date:
DEWEY: 621.3815
DEWEY edition: 22
Language: English
Number of pages: 393