Paperback (30 Nov 1996)
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Out of stock
Considers multi-chip modules from perspectives of packaging, technology and design, circuits and systems design, computer- aided design, modeling, analysis, and education. The 37 papers focus on such specific topics as wireless communications, large- area pixel detectors, fluxless flip-chips, memory hierarchy organizations, chip and package co-desi
| ISBN: | 9780818672866 |
| Publisher: | IEEE Publications,U.S. |
| Imprint: | IEEE Publications,U.S. |
| Pub date: | 30 Nov 1996 |
| DEWEY: | 621.381046 |
| Language: | English |
| Number of pages: | 194 |
| Weight: | -1g |
| Height: | 279mm |
| Width: | 222mm |
| Spine width: | 19mm |
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