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Multichip Module

Multichip Module Conference Proceedings

Paperback (31 Jan 1996)

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    Publisher's Synopsis

    The IEEE Multi-Chip Module Conference (MCMC) brings together elements of packaging technology and design, circuits and system design, computer-aided design, modeling, analysis, and education. The proceedings of MCMC'95 comprise papers and posters on manufacturing issues, applications, field programmable MCMs, electrical design, optimal system desig

    Book information

    ISBN: 9780818669705
    Publisher: IEEE Computer Society Press,U.S.
    Imprint: IEEE Computer Society Press,U.S.
    Pub date:
    DEWEY: 621.381046
    Language: English
    Number of pages: 164
    Weight: -1g
    Height: 279mm
    Width: 222mm
    Spine width: 12mm

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