Publisher's Synopsis
A new collection of authoritative contributions on the state of the art of electrochemical deposition
Since the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting–edge topics, from electrodeposition of semiconductors to environmental considerations.
Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up–to–date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next–generation technologies such as copper interconnect. Coverage includes:
∗ Electrodeposition of various metals and metal alloys
∗ Electrodeposition of semiconductors and electrodeposition on nonconductors
∗ Electrodeposition of conductive polymers
∗ Electroless deposition of various metals and alloys
∗ Preparation procedures for deposition
∗ Manufacturing technologies, monitoring, testing, and control
∗ Deposition and the environment
