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Modelling and Simulation in Thermal and Chemical Engineering

Modelling and Simulation in Thermal and Chemical Engineering A Bond Graph Approach

2000

Hardback (14 Dec 1999)

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Publisher's Synopsis

Book information

ISBN: 9783540663881
Publisher: Springer Berlin Heidelberg
Imprint: Springer
Pub date:
Edition: 2000
DEWEY: 660.01518
DEWEY edition: 21
Language: English
Number of pages: 219
Weight: 517g
Height: 234mm
Width: 156mm
Spine width: 14mm